Abstract Scope |
With the development of 5G network and automobile industry, the reliability of electronic devices become important. Damaging of the devices may occur when exposed to air-pollution, such as sulfide, sulfur oxide, and nitrogen oxide. Designing effective layers to protect devices from corrosion in electronic packaging is necessary. In this study, the corrosion behaviors of different surface coatings on printed circuit board are investigated. Sample surfaces are coated with electroless Co-based surface finishing layers. The samples are put in a chamber at 80 °C and 100% relative humidity (RH) with different concentration of SO2 for corrosion test. The morphology and composition of samples after corrosion test are compared. The results show that the Co-based surface finishes effectively inhibit the diffusion of Cu from the printed circuit board and successfully protect the electronic devices. |