About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Comparison of Corrosion for Ni- and Co-based Surface Finishes |
Author(s) |
Albert T. Wu, Si-Wei Lin, Shu-Chi Ku, Nico Li |
On-Site Speaker (Planned) |
Albert T. Wu |
Abstract Scope |
Surface finishes are used on device substrates to prevent oxidation and enhance joint strength. If the surface finishing layer cannot sustain corrosion when operating the device in high humidity ambient with corroding sulfur-containing atmosphere, corrosion products grow on the surface and damage the device. Cu atoms from the substrate diffuse to the surface when the surface finishing layer cannot act as an effective diffusion barrier due to corrosion. This study compares different corrosion behavior and diffusion barrier capability between Ni- and Co-based surface finishes. Samples are placed in SO2 chamber for different duration of time. Surface morphology, cross-sectional observation and electrochemical measurement are used for comparing the anti-corrosion mechanism. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Thin Films and Interfaces, Copper / Nickel / Cobalt |