About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Sintered Micro-silver Joints with the Addition of Indium Applied to Power IC Packaging |
Author(s) |
Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Hiroshi Nishikawa, C. Robert Kao |
On-Site Speaker (Planned) |
Chin-Hao Tsai |
Abstract Scope |
Over the past decades, the demand for high temperature power electronics soars rapidly. Due to its high power density, the operating temperature of high power devices increases, which might lead to failure of conventional low temperature tin-based packaging materials. As a result, new packaging material is needed for die attachment technology of power electronic components. In this research, silver paste composed of micro-scale particles is utilized for transient liquid phase sintering with indium foil. The purpose of adding indium to sintered micro-silver joints is to enhance the mechanical property and improve high temperature reliability. Shear tests and thermal aging tests are conducted to investigate characteristics of sintered Ag and Ag-In joints. It is concluded that Ag-In intermetallic compounds exhibit excellent mechanical property and oxidation resistance property. |
Proceedings Inclusion? |
Planned: |