About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
The Effects of DC, Pulsed DC, and AC Load Conditions on Electromigration Failure Mechanism in Solder Interconnects |
Author(s) |
Yi Ram Kim, Hossein Madanipour, Allison Theresa Osmanson, Mohsen Tajedini, Choong-Un Kim, Patrick Thompson, Qiao Chen |
On-Site Speaker (Planned) |
Yi Ram Kim |
Abstract Scope |
The effects of various current load conditions on electromigration (EM) mechanisms are investigated in this study. The lead-free Sn-Ag-Cu (SAC) alloy solder interconnects in Wafer-level Chip Scale Package (WCSP or WLSCP) are undergone accelerated EM testing with high temperature and high current densities. For comparative studies, samples are tested under various current load conditions, including pulsed direct current (DC), DC, and alternating current (AC) loads. The previously reported results indicate that pulsed DC has two competing factors that accelerate and decelerate the EM failure rate depend on duty factor. The effects of the AC load on the EM mechanism are investigated and compared to DC and pulsed DC load conditions to find any unexpected failure mechanism. We expect to have slower failure rates but similar failure mechanism to DC load, such as runaway failure. The details of the findings will be discussed in this report. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, |