About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Direct Bonding Process of (111) Nanotwinned Copper Thin Films |
Author(s) |
Jing-Yi Zhong, Yung-Ting Tai, Fan-Yi Ouyang |
On-Site Speaker (Planned) |
Jing-Yi Zhong |
Abstract Scope |
As integration density on very large scale integrated-circuits(VLSI) increases, micro solder bump may lead to mechanical damage. Thus metal - metal direct bonding has been proposed as an alternative technology. In this study, we fabricated highly (111)-preferred orientation nanotwinned Cu thin films by sputtering system. The resistivity of the deposited film is 2.1 µΩ-cm and the percentage of (111) orientation remained almost 100% after annealing at 200°C for 2 hours. Furthermore, the Cu-Cu direct bonding process can be achieved at 250°C for 30 minutes with shear strength of 16.06 MPa without any CMP process. To simulate the package in 3D IC, we also performed bump - film and bump - bump bonding process. Both samples were passed by the reliability test such as Shear test and Thermal Cycle Test (TCT). Microstructure evolution and the bonding mechanism would also be discussed in this talk. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Thin Films and Interfaces, Electrometallurgy |