Abstract Scope |
Low temperature bonding process has become an indispensable bonding process in current trends. Since Pb-based solders are prohibited due to the raise of the environmental awareness, it is essential to find other new solder materials with low melting points. In this study, indium was chosen as the solder material due to its unique properties, such as low melting point, good electrical conductivity, excellent ductility, fatigue resistance, and high thermal conductivity, to bond with nickel substrate. The interfacial reaction between molten In and solid Ni was studied. By using ion milling machine, we could get an artifact-free surface then further used SEM and EPMA to investigate the interface. For preliminary result, a continuous layer of Ni3In7 showed up at the interface with some small grooves growing between Ni3In7 and Ni. Other than interfacial morphology, mechanical properties of the intermetallic compound forming at the Ni/In interface was also investigated by indenter. |