About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Advances in Low Temperature/Low Pressure Ag Sinter Joining and Its Thermal Performance |
Author(s) |
Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aiji Suetake, Aya Iwaki, Ming Chun Hsieh, Naoki Sato |
On-Site Speaker (Planned) |
Katsuaki Suganuma |
Abstract Scope |
Sinter joining with Ag particles has been recognized as one of the key interconnection technologies especially for power electronics applications. Ag reacts with oxygen to form nanostructure among particles and bulk surfaces resulting in excellent sintering capability at low temperature even blow 200 °C. There is no need to apply high temperature or high pressure to achieve bonding/wiring.
One of the attractive features of Ag sinter joining is its thermal performance. The heat conductivity of a Ag layer sintered at 200 °C reaches about 200 W/m·K without any applied pressure. The transient thermal resistance of a sintered Ag die attach layer is below 0.05 cm2·K/W while that of high Pb solder is about 0.8 cm2·K/W. Thus Ag sinter joining can be applied not only to high performance die-attach but also to variety of heat dissipation interconnection materials. |
Proceedings Inclusion? |
Planned: |