About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Plasticity and Contact Resistance Behavior in Wirebond Packaging |
Author(s) |
Allison Theresa Osmanson, Mohsen Tajedini, Hossein Madanipour, Yi Ram Kim, Choong-Un Kim |
On-Site Speaker (Planned) |
Allison Theresa Osmanson |
Abstract Scope |
The mechanism behind contact area, geometry, and properties of wirebonds in electronic packaging was investigated in this study. This research is spurred by our recent findings suggesting an unexpected sensitivity to seemingly minor changes in the wirebond parameters such as the pad thickness. The trends observed indicate that thicker aluminum pads, shorter wire lengths, and thicker wire diameters yielded lower contact resistances. The reduction in the contact resistance is much more than what is expected from a simple change in the wire geometry, indicating the presence of a mechanism behind the contact resistance to change disproportionally with the change in wire or bond geometry, indicating that residual stress, yield strength, and the work hardening rate affects the plasticity of the wirebond. Applications of this theory can provide valuable insight that can be cultivated by the packaging industry. The details of this study will be discussed in length in this report. |
Proceedings Inclusion? |
Planned: |