About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Tailoring βSn Grain Orientations in Electronic Interconnections via Manipulating Textures of Interfacial Intermetallics |
Author(s) |
Zhaolong Ma, Ce Li, Xingwang Cheng, Suyuan Yang |
On-Site Speaker (Planned) |
Zhaolong Ma |
Abstract Scope |
Many reliability issues of electronic interconnections such as electromigration and thermomechanical fatigue are governed by βSn grain orientations. Here, we demonstrated that using single-crystal Cobalt substrates can effectively control βSn grain orientations through tailoring textures of interfacial αCoSn3 intermetallics. On (0001)Co, (11-20)Co, (10-10)Co, and (1-102)Co, interfacial αCoSn3 exhibited 2-5 symmetric orientations related to Co with reproducible orientation relationships (ORs). The orientation selection of αCoSn3 was understood by exploring i) thermodynamic stabilities of interfaces indicated by interfacial atomic matches and work of adhesion and interfacial energies calculated based on density functional theory (DFT) and ii) crystal growth kinetics indicated by the angle between (100)CoSn3 and the substrate plane. On (11-20)Co, total βSn orientations including twinned grains were reduced to 20, and on (10-10)Co, the βSn orientation featuring c-axis perpendicular to the substrate (i.e. parallel with the electron flow direction) was predicted to eliminate, which should improve the reliability of solder joints. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Solidification, |