Abstract Scope |
Nowadays, the required performance of electronic device continues to increase, making the joule heating and heat dissipation are critical issues to be solved. One of the solutions is to use heat pipes to dissipate heat. Usually, the heat pipes made of two patterned Cu foils, and they are bonded by compressive bonding at 600-800 C for 1 hour. However, the high bonding temperature soften the Cu foils. In this study, we are able to electroplate (111)-oriented nanotwinned copper on the copper substrates with randomly-oriented surface grains, and performed polishing on the Cu surfaces. Then we successful bond the two metal foils at 300℃ in 10 min. |