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About this Symposium
Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnections
Sponsorship TMS Functional Materials Division
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Tae-Kyu Lee, Cisco Systems
Albert T. Wu, National Central University
Won Sik Hong, Korea Electronics Technology Institute
Kazuhiro Nogita, University of Queensland
Govindarajan Muralidharan, Oak Ridge National Laboratory
David P. Yan, San Jose State University
Luke Arthur Wentlent, Plug Power
Scope Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in packaging materials and processes, including Pb-free and low melting temperature solders, microstructure-design, alternative interconnects, conductive adhesive, epoxy, 3D packaging and heterogeneous integration, wafer level packaging, interconnect reliability, and root cause failure analysis.

Topics of interest include, but are not limited to:

- Advanced packaging materials and processes, e.g., 3D packaging and heterogeneous integration, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding and connectors, automotive and power electronics
- Interconnects for packages, e.g., Pb-free solder, micro bumps, through-silicon-vias (TSVs), direct Cu to Cu bonding, conductive adhesive, transient liquid phase bonding, sintered nano powder joints, optoelectronic interconnects, Cu and Ag paste sintering and alternative interconnect materials at chip and package levels
- Additive manufacturing and 3D printing for electronics industry
- Other packaging materials, e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), and substrate materials
- Reliability and failure analysis for next generation packages
- Continuing challenges in implementing Pb-free solders for interconnect, low melting temperature solder alloys and solder interconnect materials for extreme environment application.
- Developments in next-generation solders for improved reliability for space exploration and aerospace application.
- Developments in solder materials and associated interconnects for automotive and power electronics
- Developments in high temperature and cryogenic temperature solder materials and associated interconnects
- Electromigration, thermo-migration, stress-migration and mechanical effects
- Whisker growth in Sn, Sn-based alloys and other metallic systems
- Advanced characterization methods as applied to interconnect technology
- Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds

Abstracts Due 07/19/2021
Proceedings Plan Planned:

Characterisation of η-(Cu,Ni)6Sn5 Formed between Cu-xNi/Sn Couples
Characterising the Intermetallic Layer in Mixed Sn-Bi Paste/SAC BGA Solder Ball Joints
Comparing Intermetallic Compound Formation in Solder Interconnects under Different Current Load Conditions
Corrosion Mechanism of Co-based Surface Finishing Layer
Cu-Cu Bonding with Silver Thin Film Capping Layer
Development of Silver─Tin Alloy Paste for High Power IC Packaging by High Energy Ball Milling
Die-bonding Performance and Mechanism of Ag Micron Paste with Pressure-less Sintering
Effect of Cu Ion Concentration on the Microstructures and Mechanical Strength of Nanotwinned Cu Films
Effect of Geopolymer Ceramic Reinforcement to the Microstructure Formation and Mechanical Properties of Sn-0.7Cu Solder Joint
Effect of Grain Size and Stress Relaxation on Whisker Growth under Applied Pressure
Electrodeposition of High Strength-ductility Cu Foils with Slanted Nanotwinned Microstructure
Electromigration Behaviors of Nanotwinned Ag Interconnects
Electromigration of Cu-Cu Joints Fabricated by of Highly (111)-oriented Nanotwinned Cu
Enhancing Mechanical Properties via Adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP Soldering by TCB Process
In-situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-voltage Transmission Electron Microscopy
In-situ Observations of Sn-58Bi/SAC305 Joints by Synchrotron Imaging
Interfacial Reaction between Cu and In-48Sn Alloy
Length Scale Dependent Mechanical Behaviour of Elastically Constrained Sn Rich Solder Joints
Low-thermal-budget Hybrid Cu-Cu Bonding with Highly <111>-oriented Nanotwinned Cu and Polyimide
Low Temperature and Presureless Cu-to-Cu Direct Bonding by Sintering of Green Synthesized Cu Nanoparticles
Low Temperature Direct Bonding in Atmosphere on Highly (111) Oriented Nanotwinned Silver
Low Temperature Solder Interconnect Board Level Shock Performance at Elevated Temperature
Microstructural Evolution of Bi Phase during Reflow and Thermal Aging in Sn-58Bi Solder
Power Cycling and Thermal Cycling Performance of Pressureless Silver Sintered Silicon Carbide Power Module Compared to Lead-free Solder Joint
Stress Development in Solder Interconnects under Pulsed Electric Current
Study of Creep Properties of Sn-Ag-Cu Alloys Employing Different Strain Rates Using Nanoindentation
Surface Precipitation and Growth of Bismuth Particles in Sn-Ag-Cu-Bi Solder Joints
Synchrotron X-ray Study of Cu Electromigration in A Blech Structure
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder with Controlled Microstructure
Thermal Characterization of Au-In Transient Liquid Phase (TLP) Bonds
Thermal Cycling Reliability Tests of Cu-Cu Joints by Two-step Bonding Processes
Thermal Expansions of βSn and Bi in Sn-Bi Alloys
Tin Whisker Growth in Space
Transient Liquid Phase (TLP) Bonding in Cu-Ni/Sn-0.7Cu/Cu-Ni Joints
Wire Bonding Novel 3D Air-metal Dielectric Structures with ISIG Passivation: Process Development and Reliability

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