|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Corrosion Mechanism of Co-Based Surface Finishing Layer
||Si-Wei Lin, Albert T. Wu
|On-Site Speaker (Planned)
The reliability of electronic devices in harsh conditions becomes significant for rapid development of 5G network and automobile industry. When devices are exposed to air-polluted environment, corrosion of the surface finishing layer could damage the reliability of the devices. In the study, corrosion behaviors of Co-based films on printed circuit boards (PCBs) are investigated. Electroless-Co and Electroless-Co/Electroless-Pd/Immersion Au layers were deposited on PCBs for comparison. Samples were placed in a chamber at 80 。C and 100% relative humidity (RH) with different concentration of SO2 for corrosion tests. After corrosion tests, the morphology and components of corrosion products were characterized. The electrochemical analysis provides the understanding of the corrosion mechanism. The results show that the Co-based layers can effectively enhance the corrosion resistance of the PCBs.
||Electronic Materials, Copper / Nickel / Cobalt, Surface Modification and Coatings