About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
NOW ON-DEMAND ONLY – Study of Creep Properties of Sn-Ag-Cu Alloys Employing Different Strain Rates Using Nanoindentation |
Author(s) |
M.A. Mamun, Donald Stone, Abdelmageed A. Elmustafa |
On-Site Speaker (Planned) |
Abdelmageed A. Elmustafa |
Abstract Scope |
The mechanical properties of SAC305 bulk and films fabricated using thermal evaporation from a SAC spool are reported. XRD, FE-SEM, AFM, and nanoindentation were used to investigate the SAC films crystal structure, thickness, grain structures, surface morphology, and SAC mechanical properties. XRD diffraction of the SAC films exhibited β-Sn crystallographic planes of (200), (101), and (211) orientations with a dominant β-Sn (200) at 2Θ = 30.5°. FE-SEM images indicated formation of a discontinuous film of a thickness of 70-75 nm and AFM images depicted formation of equiaxed grains of grain size between 5-100 nm. For bulk SAC material, we conclude that the hardness increases with the increase of the strain rate and the modulus was not influenced by the strain rate. Changing the hold time at peak loads or the rate of loading for the creep experiments had no measurable bearing on the creep properties of the bulk SAC material. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Mechanical Properties, |