|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Low-thermal-budget Hybrid Cu-Cu Bonding with Highly <111>-oriented Nanotwinned Cu and Polyimide
||Pin-Syuan He, Kai-Cheng Shie, Chih Chen
|On-Site Speaker (Planned)
In this study, highly <111>-oriented nanotwinned Cu (nt-Cu) was combined with polyimide (PI) to achieve the low thermal budget hybrid bonding (<250 ℃). We adopted three bonding scenarios to confirm the possibility of this approach: (A) PI-PI, (B) Cu/PI-PI, and (C) Cu/PI-nt-Cu bonding. For the PI-PI bonding, the imidization degree (DI) increased significantly and bonding interface was eliminated if the PI partial curing condition was 230 ℃ and below 0.3tfull curing. For the Cu/PI-PI bonding, the bonding interface of PI/PI was removed and an excellent adhesion between Cu pad and PI film was obtained. For the Cu/PI-nt-Cu bonding, we found an obvious gap between Cu pad and nt-Cu film due to Cu pad dishing and dome shape PI caused by hybrid structure co-planarization issue. Thus, to achieve the nt-Cu/PI hybrid bonding, we can predict the required Cu protrusion with the mismatch of Cu and PI in linear expansion coefficients.
||Other, Other, Other