About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
Wire Bonding Novel 3D Air-metal Dielectric Structures with ISIG Passivation: Process Development and Reliability |
Author(s) |
Yipin Wu, Pichaya Sommai, Joyce Christiansen-Salameh, Jim Clatterbaugh, Leyla Hashemi-Sadraei |
On-Site Speaker (Planned) |
Pichaya Sommai |
Abstract Scope |
PolyStrata® is a 3D air-metal-dielectric copper structure which allows miniaturization of complex RF components including filters, combiners and baluns integrated into devices such as signal analyzer frequency extenders and arbitrary waveform generators. For PolyStrata®
to meet RF performance at 100+ GHz, standard NiAu electroplating with 1 um Au no longer meets test specifications due to the high loss in the Ni layer. Instead, a thin layer of Immersion Silver Immersion Gold (ISIG) is introduced with only 20 nm Au. Wire bonding process development explores silver oxidation, plating adhesion and Au-Au weld formation, ultimately enabling a repeatable and reliable process for a range of IG thicknesses starting at 20 nm. Additionally, an autocatalytic plating process is examined to achieve a consistent 100 nm IG metallization which further allows compatibility with oxygen plasma cleaning in microcircuit manufacturing processes. |
Proceedings Inclusion? |
Planned: |
Keywords |
Process Technology, Surface Modification and Coatings, |