| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Electromigration of Cu-Cu Joints Fabricated by of Highly (111)-oriented Nanotwinned Cu |
| Author(s) |
Shih Chi Yang, Chih Chen |
| On-Site Speaker (Planned) |
Shih Chi Yang |
| Abstract Scope |
As the size of joints scales down below 10 μm, side wetting and bridging failure would occur in solder joints. Cu-Cu bonding has appeared to be a solution to the limitation of scaling down of solder joints and retard RC delay in 3D IC. However, the strength and reliability of Cu joints are still of concerns.
In this study, the Cu joints are fabricated by highly (111)-oriented nanotwinned Cu . We performed instant and post-annealing bonding steps. Tensile tests were conducted to characterize the bonding strength of the Cu joints. Electromigration tests were performed to investigate the reliability of the Cu joints. The failure mechanism and the influence of nanotwinned structure were analyzed after the joint resistance increased 20% of its initial value. The Cu-Cu interface has high electromigration resistance when grain growth takes place across the bonding interface, and the weakest link may locate in the redistribution Cu lines.
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| Proceedings Inclusion? |
Planned: |
| Keywords |
Electrometallurgy, Joining, Electronic Materials |