|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Die-bonding performance and mechanism of Ag micron paste with pressure-less sintering
||Tetsu Takemasa, Chuantong Chen, Katsuaki Suganuma
|On-Site Speaker (Planned)
Ag particle paste sintering has been developed and shown a good performance in areas such as high-temperature reliability and high electronic conductivity. Recently, it was found that the microstructure of a sintered Ag layer exhibits a coarse-dense inhomogeneous distribution after sintering, which depends on the loading speed of a die during the chip mounting process due to the flow characteristics of the Ag particle paste. In this work, the effect of the die mounting speed and the push-in amount (push depth) in the die mounting process on the microstructure of the sintered Ag layer, shear strength and thermal cycling reliability of Ag sinter joint structures were investigated.
||Electronic Materials, Joining,