About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
In-situ Observations of Sn-58Bi/SAC305 Joints by Synchrotron Imaging |
Author(s) |
Mohd Arif Anuar Salleh, M.I.I. Ramli, D.S.C. Halin, N. Saud, T. Nishimura, H. Yasuda, K. Nogita |
On-Site Speaker (Planned) |
Mohd Arif Anuar Salleh |
Abstract Scope |
The interaction and process of mixed assemblies facilitated by the use of low temperature solders is of increased importance. This paper investigates the solid-liquid interaction between liquid Sn-58Bi solder paste and solid Sn-3.0Ag-0.5Cu (SAC305) solder alloy during soldering on Cu organic soldering preservative (Cu-OSP) substrate. The effect of reflow time and temperature (lower than liquidus temperature of SAC305) on the solid/liquid interaction in Sn-58Bi/SAC305 mixed assemblies have been studied using an in-situ synchrotron imaging technique. The dissolution rate of solid SAC305 alloy into Sn-58Bi and microstructures in the solder joints is discussed with respect to the soldering time and temperature. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Characterization, Electronic Materials |