About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
Transient Liquid Phase (TLP) Bonding in Cu-Ni/Sn-0.7Cu/Cu-Ni Joints |
Author(s) |
Nurul Razliana Abdul Razak, Xin Fu Tan, Stuart McDonald, Michael Bermingham, Hideyuki Yasuda, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Nurul Razliana Abdul Razak |
Abstract Scope |
Bonding methods involving a transient liquid phase (TLP) have potential applications for high-operating temperature Pb-free solder electrical interconnection, including power modules in hybrid and electric vehicles. These methods typically involve the formation of high-melting temperature phases via the interdiffusion of low and high melting temperature phases. In Sn/Cu based systems, slow kinetics and uncontrolled porosity are significant challenges that must be overcome. The addition of Ni to Cu can significantly accelerate the TLP process. Through a synchrotron X-ray microradiography technique, the TLP soldering process for Sn-0.7Cu with different compositions of Cu-Ni substrates was successfully observed in real-time. This allowed the kinetics of the reaction to be quantified and provided insight into the formation and distribution of porosity. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Joining, Other |