About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
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Electronic Packaging and Interconnections
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Presentation Title |
Effect of Geopolymer Ceramic Reinforcement to the Microstructure Formation and Mechanical Properties of Sn-0.7Cu Solder Joint |
Author(s) |
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Nur Nadiah Izzati Zulkifli, Nur Syahirah Mohamad Zaimi, Mohd Mustafa Albakri Abdullah |
On-Site Speaker (Planned) |
Mohd Izrul Izwan Ramli |
Abstract Scope |
This paper investigates the effect of kaolin geopolymer ceramic (KGC) reinforcement to the microstructure formation and mechanical properties of Sn-0.7Cu lead-free solder. Besides conventional cross-section techniques, advanced characterization techniques such as synchrotron micro-XRF and tomography imaging were used to study the microstructure of the kaolin geopolymer ceramic and the composite solder. Experimental results show that the kaolin geopolymer ceramic refines the β-Sn area while increases the eutectic area. Synchrotron micro-XRF also indicated that some Al and Si element, which major in kaolin geopolymer system were in the solder matrix area. The result of the mechanical properties of this composite solder also showed that the addition of kaolin geopolymer ceramic has higher strength and can be proposed as a potential reinforcement material in composite solder. |
Proceedings Inclusion? |
Planned: |
Keywords |
Composites, Joining, Ceramics |