|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder with controlled microstructure
||Tianhong Gu, Christopher M Gourlay, Ben Britton
|On-Site Speaker (Planned)
Sn-3Ag-0.5Cu wt.% is widely used as a solder alloy in electronic interconnections, where the life of the components can be limited through thermomechanical failure of the solder joints. Here we assess the effect of secondary dendrite arm spacing (λ2), eutectic intermetallic spacing (λe) and intermetallic compound (IMC) size in SAC305 solder on creep in samples containing a single crystal of beta-Sn with near-<110> orientation along the loading direction. Creep is investigated under constant load tensile testing at a range of temperatures (298 - 473 K) to quantify the role of these lengthscale effects on the secondary creep strain rate and activation energy. The deformation mechanisms are investigated using electron backscatter diffraction (EBSD) and strain heterogeneity is identified between beta-Sn in dendrites and beta-Sn in eutectic regions containing Ag3Sn and Cu6Sn5 particles. This motivates our hypothesis about the role of these microstructural features and creep performance.
||Electronic Materials, Mechanical Properties, Other