|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Tin whisker growth in space
||Katsuaki Suganuma, Norio Nemoto, Tsuyoshi Nakagawa, Seiichiroh Kan, Shinichiroh Ichimaru
|On-Site Speaker (Planned)
The authors reported that tin whisker growth in vacuum simulating a pace environment, severe thermal cycling in vacuum. The result showed much serious whisker growth than those used in normal air environment. The real space thin whisker growth experiment on tin plated samples, 42 alloy plates, copper pates and ceramic components, by the Kibou station of International Space Station (ISS) for three years. The first one year samples returned. One year in ISS makes about 6000 thermal cycles. The highest temperature was estimated as 65 ºC. Microstructural observation revealed that thin straight whiskers of a few hundreds µm grew on tin plated 42 alloy plates and ceramic components. In contrast, controlled thermal cycled samples on the earth showed short winding whiskers, which is a typical thermal cycling whisker. The detail whisker growth mechanism in space will be discussed.
||Electronic Materials, Joining, Other