| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Characterisation of η-(Cu,Ni)6Sn5 Formed between Cu-xNi/Sn Couples |
| Author(s) |
Xin Fu Tan, Qinfen Gu, Michael Bermingham, Stuart McDonald, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Xin Fu Tan |
| Abstract Scope |
The transient liquid phase soldering (TLPS) process between Sn and Cu to form a coherent matrix of Cu6Sn5 intermetallic compounds (IMCs) can be greatly accelerated if, instead of pure Cu, a Cu-xNi alloy is used as a substrate. This enables the formation of a bond that is stable at high temperatures in a time comparable with that of conventional reflow soldering. Depending on the Ni concentration, the (Cu,Ni)6Sn5 IMCs formed are different from the well-studied Cu6Sn5 with altered morphologies and crystal structures, which may influence the mechanical and physical properties of the joint. The IMCs growth rates at different Ni concentrations also have a direct impact on the bonding process in industry applications. In this study, scanning electron microscopy, electron backscatter diffraction, synchrotron powder X-ray diffraction and density functional theory calculations were used to characterise the η-(Cu,Ni)6Sn5 formed between Cu-xNi/Sn couples and to reveal the mechanisms of the accelerated growth. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, |