|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Thermal expansions of βSn and Bi in Sn-Bi alloys
||Qichao Hao, Xin Fu Tan, Qinfen Gu, Stuart McDonald, Kazuhiro Nogita
|On-Site Speaker (Planned)
During the soldering process and the daily operation of the electronic devices, solder alloys experience temperature variation frequently. The mismatch in volume expansion of the solder alloys and the interconnected components can result in stresses which lead to failure. In an alloy system with high solubility of one element in another, the effects of thermal expansion and the solubility limits are both important contributing factors to the thermal induced volume change. In this study, Sn-57wt%Bi and Sn-37wt%Bi alloys which are promising material for low-temperature solders were investigated by in-situ heating synchrotron X-ray diffraction (XRD) to reveal the changes of the lattice parameters of Sn and Bi. Density functional theory (DFT) calculations was adopted to reveal the influence of the solid solution of Bi on the lattice parameters of βSn, thereby decoupling the effects of thermal expansion and solid solution of Bi on the thermal induced volume change of Sn.
||Electronic Materials, Other,