|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||In-situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy
||Xin Fu Tan, Kazuhiro Nogita, Flora Somidin, Stuart McDonald, Hiroshi Maeno, Syo Matsumura
|On-Site Speaker (Planned)
The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilising creative setups to “freeze” the reactions at different stages during the reflow soldering process. However, detail understanding of the dynamics of the process is difficult due to the lack of direct observation with micro- and nano-level resolution. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder alloy and a Cu substrate in-situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.
||Electronic Materials, Joining, Phase Transformations