About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
Enhancing Mechanical Properties via Adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP Soldering by TCB Process |
Author(s) |
Zih You Wu, Junq Gong Duh |
On-Site Speaker (Planned) |
Zih You Wu |
Abstract Scope |
Recently, transient liquid phase (TLP) bonding process has become a promising method in advanced electronic packaging. Full intermetallic compounds (IMCs) joints provide good strength and reliable high-melting-point phase after bonding. However, Kirkendall voids and preferred orientation of Cu6Sn5 may deteriorate the reliability in conventional Cu/Sn/Cu bump. To resolve these problems and to enhance the mechanical proprieties, Ni and Zn are used to modify the overall microstructures of the TLP bonding. After the addition of Ni and Zn, the strength of Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump increased significantly, as compared to Cu/Sn3.5Ag/Cu. Both Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump demonstrated favorable strength and toughness. Moreover, microstructure, grain and mechanical analyses are employed to elucidate the mechanisms behind the strengthening effect of Ni and Zn in Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Mechanical Properties, Phase Transformations |