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Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnections
Presentation Title Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP soldering by TCB process
Author(s) Zih You Wu, Junq Gong Duh
On-Site Speaker (Planned) Zih You Wu
Abstract Scope Recently, transient liquid phase (TLP) bonding process has become a promising method in advanced electronic packaging. Full intermetallic compounds (IMCs) joints provide good strength and reliable high-melting-point phase after bonding. However, Kirkendall voids and preferred orientation of Cu6Sn5 may deteriorate the reliability in conventional Cu/Sn/Cu bump. To resolve these problems and to enhance the mechanical proprieties, Ni and Zn are used to modify the overall microstructures of the TLP bonding. After the addition of Ni and Zn, the strength of Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump increased significantly, as compared to Cu/Sn3.5Ag/Cu. Both Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump demonstrated favorable strength and toughness. Moreover, microstructure, grain and mechanical analyses are employed to elucidate the mechanisms behind the strengthening effect of Ni and Zn in Cu18Ni/Sn3.5Ag/Cu and Cu18Ni18Zn/Sn3.5Ag/Cu bump.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Mechanical Properties, Phase Transformations

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Characterisation of η-(Cu,Ni)6Sn5 formed between Cu-xNi/Sn couples
Characterising the intermetallic layer in mixed Sn-Bi paste/SAC BGA solder ball joints
Comparing Intermetallic Compound Formation in Solder Interconnects under Different Current Load Conditions
Corrosion Mechanism of Co-Based Surface Finishing Layer
Cu-Cu bonding with silver thin film capping layer
Development of Silver─Tin Alloy Paste for High Power IC Packaging by High Energy Ball Milling
Die-bonding performance and mechanism of Ag micron paste with pressure-less sintering
Effect of Bi-modal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints
Effect of Cu Ion Concentration on the Microstructures and Mechanical Strength of nanotwinned Cu films
Effect of Geopolymer Ceramic Reinforcement to the Microstructure formation and Mechanical Properties of Sn-0.7Cu Solder Joint
Effect of grain size and stress relaxation on whisker growth under applied pressure
Electrodeposition of High Strength-Ductility Cu Foils with Slanted Nanotwinned Microstructure
Electromigration Behaviors of Nanotwinned Ag Interconnects
Electromigration of Cu-Cu Joints Fabricated by of Highly (111)-Oriented Nanotwinned Cu
Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP soldering by TCB process
IMC Suppression and Phase Stabilization of Cu/Sn-Bi/Cu microbump via Zn doping
In-situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy
In-situ observations of Sn-58Bi/SAC305 joints by synchrotron imaging
Interfacial Reaction between Cu and In-48Sn Alloy
Length scale dependent mechanical behaviour of elastically constrained Sn rich solder joints
Low-thermal-budget Hybrid Cu-Cu Bonding with Highly <111>-oriented Nanotwinned Cu and Polyimide
Low temperature and presureless Cu-to-Cu direct bonding by sintering of green synthesized Cu nanoparticles
Low Temperature Direct Bonding in Atmosphere on Highly (111) Oriented Nanotwinned Silver
Low Temperature Solder Interconnect board level Shock Performance at elevated temperature
Microstructural evolution of Bi phase during reflow and thermal aging in Sn-58Bi solder
Power Cycling and Thermal Cycling Performance of Pressureless Silver Sintered Silicon Carbide Power Module Compared to Lead-Free Solder Joint
Retaining multi-oriented and fine grain structure in Cu/SAC305-0.1Ni/Cu microbump via isothermal aging treatment
Role of the aging treatment in the microstructure evolution and tensile strength of Cu/Sn-Bi-Ag-In/Cu joint
Stress Development in Solder Interconnects Under Pulsed Electric Current
Study of creep properties of Sn-Ag-Cu Alloys employing different strain rates using nanoindentation
Surface Precipitation and growth of Bismuth particles in Sn-Ag-Cu-Bi solder joints
Synchrotron X-ray Study of Cu Electromigration in A Blech Structure
The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder with controlled microstructure
Thermal Characterization of Au-In Transient Liquid Phase (TLP) Bonds
Thermal cycling reliability tests of Cu-Cu joints by Two-step Bonding Processes
Thermal expansions of βSn and Bi in Sn-Bi alloys
Tin whisker growth in space
Transient liquid phase (TLP) bonding in Cu-Ni/Sn-0.7Cu/Cu-Ni joints
Wire Bonding Novel 3D Air-metal Dielectric Structures with ISIG Passivation: Process Development and Reliability

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