About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections
|
Presentation Title |
Low Temperature and Presureless Cu-to-Cu Direct Bonding by Sintering of Green Synthesized Cu Nanoparticles |
Author(s) |
Albert T. Wu, Wei Liu, Chang-Meng Wang |
On-Site Speaker (Planned) |
Albert T. Wu |
Abstract Scope |
Cu nanoparticle (NP) sintering is a promising technique to form Cu bond that can be applied to advance electronic packaging technique for its possible excellent physical properties and reasonable cost. In this study, Cu NPs are prepared by chemical reduction method with non-toxic reducing agent without capping agent. Particle size of the Cu NPs can be controlled by adjusting the pH values of the reducing solution. The synthesized Cu NPs are mixed with a bio-compatible solvent to form Cu NP paste and bonds Cu substrates at low temperature without pressure. An iterating reduction mechanism is proposed. The oxide layer on the Cu NP acts as a catalyst which triggers the decomposition of the solvent at low temperature. The decomposed products further reduce the oxide layer and allow the sintering of Cu NP without reducing atmosphere. A high quality Cu-to-Cu bond can be achieved by choosing proper synthesizing parameters. |
Proceedings Inclusion? |
Planned: |
Keywords |
Copper / Nickel / Cobalt, Electronic Materials, |