|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Microstructural evolution of Bi phase during reflow and thermal aging in Sn-58Bi solder
||Amey Luktuke, Sridhar Niverty, Hamidreza Torbati-Sarraf, Fengjiang Wang, Aniket Tekawade, Viktor Nikitin, Rajkumar Kettimuthu, Nikhilesh Chawla
|On-Site Speaker (Planned)
Sn-58Bi solder alloy is considered an ideal alternative to Sn-Pb and SAC solder alloys due to its significantly lower melting point. Bi phase plays a crucial role in determining the mechanical behavior and reliability properties of Sn-58Bi solder joint. The mechanisms governing the evolution of the Bi phase during solidification and thermal aging are not well understood. In this study, we investigate the microstructural and morphological evolution of the Bi phase during reflow in Sn-58Bi solder using x-ray tomography. A novel approach of real-time data streaming, reconstruction, and segmentation at microtomography beamline 2-BM of the Advanced Photon Source (APS) is used to understand the formation of the Bi particles and Sn dendrites during solidification. Coarsening of Bi phase during room temperature and high-temperature aging is studied using SEM, EBSD, EDS, and nanoindentation. Unique insights into the evolution of eutectic microstructure and the growth of the Bi particles will be discussed.
||Electronic Materials, Solidification, Phase Transformations