|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Effect of Bi-modal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints
||Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, Jee-Sung Kim, Dongjin Byun, Junghwan Bang
|On-Site Speaker (Planned)
In this study, The microstructure change and mechanical strength of the sintered joint were evaluated according to the sintering time and Bi-modal Cu paste after producing 5 pastes according to Cu micro and nano powder mixing. The sintering reactions of Cu sinter paste with two different surface finishes, Cu and electroless nickel-immersion gold, were evaluated.
A denser sintered layer and excellent microstructure were observed as the sintering time increased. The shear strength was highest in the paste prepared with 1 Ám Cu powder and 300 nm Cu powder in a ratio of 25:75 wt.%. The Cu finished joint exhibits superior interfacial stability and shear strength compared to the Au finished joints.