|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||IMC Suppression and Phase Stabilization of Cu/Sn-Bi/Cu microbump via Zn doping
||Rui Wen Song, Yin-Ku Lee, Chen-Sung Chao, Pin-Wei Huang, Jenq-Gong Duh
|On-Site Speaker (Planned)
For the advanced 3D-IC application, there is typically problems of warpage and low thermal budget. Therefore, low temperature soldering for microbumps is preferred. In this study, Sn-Bi-Zn low temperature solder was studied for its low cost and accessibility. Via doping Zn and adding Sn in solder or substrate, the solder alloy was strengthened, and microstructure was expected to elevate mechanical properties. The stabilization of melting point via Zn/Sn in substrate was also discussed. The phases were identified by WDS mapping and the Kirkendall void reduction was demonstrated in this study.
||Mechanical Properties, Solidification, Joining