|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Retaining multi-oriented and fine grain structure in Cu/SAC305-0.1Ni/Cu microbump via isothermal aging treatment
||Yu-Ching Wang, Jenq-Gong Duh, Yin-Ku Li, Pin-Wei Huang, Chen Sung Chao
|On-Site Speaker (Planned)
The microstructure of Cu/Sn-3.0Ag-0.5Cu/Cu and Cu/Sn-3.0Ag-0.5Cu-0.1Ni/Cu micro-bumps were investigated. Doping Ni in the solder could refine the grain size and diversify the growth orientation of intermetallic compounds (IMCs). Nevertheless, smaller grain would be consumed and merged by the larger one as sufficient reflow time was carried out, resulting in the vanish of random-oriented grain structure. It was demonstrated that dispersive and fine crystal structure would be retained under 180 hr annealing test, and the phenomenon of Ni accumulation along bottom interface did not disappear. Moreover, this diverse structure still existed even if 1000 hr aging test was applied, and network-type morphology of Cu3Sn were also observed at Cu6Sn5/Cu3Sn interface. Thus, the joint reliability was expected to be enhanced via interlocking mechanism after long time aging.
||Electronic Materials, Copper / Nickel / Cobalt, Joining