|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Thermal Characterization of Au-In Transient Liquid Phase (TLP) Bonds
||Joyce Christiansen-Salameh, Leyla Hashemi-Sadraei
|On-Site Speaker (Planned)
For high power density components, thermal dissipation and thermal stability of the die attach layer becomes increasingly important. TLP bonds are formed by solid-liquid interdiffusion of a low melting point filler metal between two plated surfaces, resulting in a thin intermetallic layer that can withstand temperatures exceeding 600 °C. In this work, the thermal properties of Au-In TLP bonds are characterized and related to process parameters and microstructure. An analysis of interfacial thermal transport and the effect of voiding is included. For reference to other die attach materials, Ag-filled epoxy, SAC solder, and Ag-sintered paste are also characterized.
||Characterization, Joining, High-Temperature Materials