|About this Abstract
||2022 TMS Annual Meeting & Exhibition
||Electronic Packaging and Interconnections
||Electrodeposition of High Strength-Ductility Cu Foils with Slanted Nanotwinned Microstructure
||Dinh-Phuc Tran, Kuan-Ju Chen, Fu-Chian Chen, Chih Chen
|On-Site Speaker (Planned)
In this study, we employed rotary electroplating to fabricate a new microstructure of nanotwinned copper (nt-Cu) with slanted columnar grains. We found that the slanted columnar microstructure of nt-Cu is attributed to the enhanced mechanical properties. The results show that the slanted columnar nt-Cu foils have greater tensile strength and ductility than that of straight columnar counterparts. Additionally, the tensile strength and ductility of the nt-Cu foils increase with increasing additive concentration and current density. We found that the incline of slant degree leads to the activation of multiple dislocation slip systems. The strengthening effect of slanted grains contributes to the enhanced tensile strength and ductility of the nt-Cu foils, accordingly. As the current density and additive concentration increase, the slant degree between columnar grains and electroplating substrate is more inclined. The current method with high deposition rate is thus potential for mass production of high strength-ductility nt-Cu foils.
||Characterization, Mechanical Properties, Electronic Materials