About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections
|
| Presentation Title |
Thermal Cycling Reliability Tests of Cu-Cu Joints by Two-step Bonding Processes |
| Author(s) |
Jia Juen Ong, Kai Cheng Shie, Chih Chen |
| On-Site Speaker (Planned) |
Jia Juen Ong |
| Abstract Scope |
This study shows the relationship between the reliability of Cu joints and their microstructures. We adopted a 2-step bonding process to fabricate Cu-Cu joints, which includes a short-time initial bonding at 300 C for tens of seconds, and a post-annealing process at 300 C for 1 h We investigate failure modes for the thermal cycling tests after 1000 cycles. Results show that the resistance of samples without post-annealing increased significantly. While the resistance of the 2-step bonding slightly increased. We found cracks formed at the bonding interface of the as-bonded samples and such a cracking failure causes the increase in resistance. However, the cracks do not lead to failure of the joints in the post-annealed samples due to the growth of oriented grain across the bonding interface. Failure analysis show that cracks propagated along the zig-zag grain boundaries and slow down crack propagation and enhance the bonding quality and reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electrometallurgy, Electronic Materials, Joining |