About this Abstract |
Meeting |
2024 TMS Annual Meeting & Exhibition
|
Symposium
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Alloys and Compounds for Thermoelectric and Solar Cell Applications XII
|
Presentation Title |
Effect of Electrode Materials on the Property of Bi2Te3 and Sb2Te3 Thin Film Module |
Author(s) |
Albert T. Wu, Kai-Wen Cheng, Zhen-Wei Sun |
On-Site Speaker (Planned) |
Albert T. Wu |
Abstract Scope |
The long-term aging process is a critical factor when considering thermoelectric modules for practical applications. This study analyzed Bi2Te3 and Sb2Te3 thin films, utilizing Cu and Ni electrodes, to understand the diffusion behavior and interfacial stability during prolonged aging. For Sb2Te3, the rapid diffusion of Cu led to the formation of a Cu-Te intermetallic compound, reducing the power factor. The formation of a Ni-Te reaction layer acted as a self-barrier and degraded contact resistivity. Growth of Sb2O3 resulted in Sb deficiency, thereby increasing the power factor. For Bi2Te3, both pristine and Ni/Bi2Te3/Ni samples transitioned from n to p-type by forming antisite defects, resulting in power factor degradation. Diffusion of Cu through the Bi2Te3 film elevated contact resistivity. Nonetheless, the migration of Cu from the electrodes significantly mitigated power factor degradation after long-term aging. This knowledge offers valuable guidance for future innovation of these devices. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Energy Conversion and Storage, Electronic Materials |