| About this Symposium |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
| Sponsorship |
TMS Functional Materials Division
TMS: Alloy Phases Committee
|
| Organizer(s) |
Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Chung University
Chih-Ming Chen, National Chung Hsing University
Jae-Ho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
Ming-Tzer Lin, National Chung Hsing University
Yee-wen Yen, National Taiwan University of Science and Technology
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ligang Zhang, Central South University
Sehoon Yoo, Korea Institute of Industrial Technology
Vesa Vuorinen, Aalto University
Yu-Chen Liu, National Cheng Kung University
Ting-Li Yang, National Yang Ming Chiao Tung University |
| Scope |
This is the 22nd in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials. |
| Abstracts Due |
07/17/2022 |
| Proceedings Plan |
Planned: |