| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
| Presentation Title |
C-9: 3D Electromagnetic Analysis and VNA Measurement of High-speed Signal Transmission in HLC-PCBs: Via Stub Effect |
| Author(s) |
Pei-Chia Hsu, Ying-Chih Chiang, Shun-Cheng Chang, Sheng-Wei Wu, Cheng-Hao Ching, Cheng-En Ho |
| On-Site Speaker (Planned) |
Pei-Chia Hsu |
| Abstract Scope |
The demand of high data rates requires the usage of large bandwidths for high-speed digital signal transmission, and the high-frequency/-speed signal transmission is now being adopted in communication satellites, short-range targeting radars, and web servers to meet such a requirement today. Since the high-frequency/-speed signal integrity has become the critical issues in various product designs, a comprehensive study of the signal transmission performance in transmission lines is of fundamental interest and practice importance. In this study, we investigated the via stub effect on the signal transmission performance at 1–40 GHz frequency bands in high-layer-count printed circuit boards through the finite element analysis method with a 3D electromagnetic simulation software and vector network analyzers measurement. The research results showed that the remaining stub structure can degrade the signal transmission performance, and should be as short as possible, especially in high-frequency signal transmission. Details will be presented in this present work. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |