|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Microstructure and Interface Evolution of Bare Cu-Cu Bonding Using Cu-Ag Composite Paste during High Temperature Application
||Chuantong Chen, Takuya Sekiguchi, Katsuaki Suganuma
|On-Site Speaker (Planned)
Currently, the high cost of sintering Ag particles and the oxidation problem of sintering Cu particles under air conditions need to be solved for large-scale industrial applications. Herein, by proposing a micron-sized Cu particle and Ag–amino composite (Cu–Ag composite), a robustly bare Cu–Cu bonding was realized under a low sintering pressure and temperature (300°C) under air atmospheric conditions. The microstructure and interface evolution of bare Cu-Cu bonding using the Cu-Ag composite paste during high temperature aging were evaluated. The results suggested that the Cu–Ag composite as a die attach material has remarkable potential applications to a bare Cu substrate bonding in SiC power devices, which could meet the requirements of power electronics in high temperature application.
||Joining, Electronic Materials, Composites