|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Electric Current Effects upon ƞ & ƞ’ Cu6Sn5 Intermetallic Compound
||Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin
|On-Site Speaker (Planned)
Due to the kept-increasing current density in the advanced packaging, the electromigration effect significantly causes the material’s microstructure and phase stability change. Intermetallic compounds (IMC) typically form at the bonding interface and determine the reliability of the interconnection. Cu6Sn5 is a commonly seen IMC, which exhibits hexagonal (ƞ) & monoclinic (ƞ’) structures above the below the transition temperature of 186 ℃, respectively. Nevertheless, electric current effects upon ƞ and ƞ’ phase and their transition were still not clear. In this study, we fabricated single-phase ƞ and ƞ’ samples and observed the morphological changes. In-situ analysis was performed. We discussed the electric current effect upon the phase stability and its change of the ƞ and ƞ’ phases in this study.
||Other, Other, Other