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Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
Presentation Title Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage
Author(s) Hiroaki Tatsumi, Hiroshi Nishikawa
On-Site Speaker (Planned) Hiroaki Tatsumi
Abstract Scope High power density operation of electronics devices, such as power modules, causes heat density increase. Therefore, a highly thermal-conductive and high-temperature reliable joint is demanded in electronics packaging. This study proposes a novel anisotropic Cu-solder composite joint by using a unidirectional porous Cu sheet and Sn-Ag-Cu (SAC) solder. During a simple reflow process at 260 C, the anisotropic composite joint was successfully fabricated through the molten solder penetration into the porous-Cu pores. Steady-state thermal conductivity measurement showed that the equivalent thermal conductivity of this joint was approximately 2.5 times higher than that of the SAC-soldered joint. Finite element simulation revealed the unidirectional Cu structure contributed to thermal conductivity enhancement. High temperature storage (HTS) test at 200 C for 1008 h demonstrated its stable joint strength: 48.8 (0 h) and 46.3 MPa(1008 h). These results have proven that this novel anisotropic composite joint is promising for high-temperature electronics applications.
Proceedings Inclusion? Planned:
Keywords Joining, Electronic Materials, Modeling and Simulation

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3d-transition Metal-tin Compounds
3D Electromagnetic Simulation and Experimental Measurements of Performance of Antenna at mm-wave Frequencies: Surface Finish Effect
A Novel Synthesis Method of Cu NWs by Nucleation Control
Ab Initio Exploration of Alloying Elements for Stabilizing η’ Nanoprecipitates in Al-Zn-Mg Alloys
Ag and Cu Whisker Formation
Alternative Metal with Lower Resistivity than Cu: A First-principles Study
C-10: Bi-Sb-Se-Te Phase Equilibria Isothermal Tetrahedron at 400℃
C-11: Effect of De-twinning on Tensile Strength of Nano-twinned Cu Films
C-12: Laser-assisted Die Attach Process for SiC Power Semiconductor
C-9: 3D Electromagnetic Analysis and VNA Measurement of High-speed Signal Transmission in HLC-PCBs: Via Stub Effect
Competitive Degradation Mechanisms and Design Considerations for On-chip Resistor Structures
Composition Design of Coherent Precipitate-strengthening Multi-principal Element Alloys by High-throughput CALPHAD-type Calculation
Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step
Dissolution Behavior in the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, SAC305, and Sn-58Bi Solders
Effect of Cu Addition on Mechanical Properties of In-Sn Alloy Before and After Isothermal Aging
Effect of Trace Bi on the Mechanical Strength of Sn Solder Before and After Thermal Aging
Electric Current-induced Lattice Strain and Grain Orientation Change in Silver Strip
Electric Current Effects upon ƞ & ƞ’ Cu6Sn5 Intermetallic Compound
Electromigration-induced Abnormal IMC Volume Expansion in Micro Joints with Au/Pd(P)/Ni(P) Surface Finish
Employment of Diamond-like Carbon and Chromium Carbide Coatings as Diffusion Barrier Layers against Ga-based Thermal Interface Materials (TIMs): Efficacy and Impact on Heat Transfer
Flip-chip Encapsulation with Hybrid Organic Inorganic Passivation of Perovskite Solar Cells
Interfacial Reactions in the Lead-free Solders/Cu-Fe Alloy(C194) Couples
Machine Learning Models of Ultimate Tensile Strength and Elongation for Low-temperature Solder
Mechanism of Microstructure Evolution between Bi-Sn Layer Deposition and Substrate Elements
Microstructure and Interface Evolution of Bare Cu-Cu Bonding Using Cu-Ag Composite Paste during High Temperature Application
Multistep Electroplating for the Uniform Composition of Invar Electroplating
Research on the Mechanism of ENEPIG/Solder Joint Reliability
SAC-In,Bi(Sb) Solder Joints with Multiphase Microstructures and Their Mechanical Properties Guided by CALPHAD Design
Solder Joint Properties of Nickel-less Surface Finishes - Direct Electroless Gold (DEG) and Electroless Palladium Immersion Gold (EPIG)
Solid/Solid State Interfacial Reactions between Lead-free Solders and Cu-Ti Alloy(C1990HP)
Study of Interfacial Stability for Medium-temperature GeTe-based Thermoelectric Modules
Synchrotron White X-ray Nanodiffraction Study of Tin Whisker Growth Driven by Electric Current
Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage
Thermal Stability of Highly (111)-oriented Nanotwinned Ag Thin Film during Annealing Process
Two Phase Stability Affecting Electromigration Failure Mechanism of Solder Alloys
Use of Molecular Dynamics Simulations to Examine Crystal Growth from the Melt in Pure Sn Systems

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