|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Synchrotron White X-ray Nanodiffraction Study of Tin Whisker Growth Driven by Electric Current
||Wan-Zhen Hsieh, Pei-Tzu Lee, Cheng-Yu Lee, Cheng-En Ho
|On-Site Speaker (Planned)
Recently, tin (Sn) whisker growth becomes a serious reliability concern with the widespread utilization of lead (Pb)-free solders and Sn-based surface finishes in commercial and industrial electronics. We conducted a synchrotron study via white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source) to characterize the Sn whiskering behavior upon electron current stressing. Laue diffraction patterns showed that the needle-type Sn whiskers are basically single crystalline with a preferred orientation with its c-axis in the direction perpendicular to the electron flow, indicating that the electromigration-induced Sn whiskers prefer to grow with a lower resistivity, higher diffusivity, and smaller Young’s modulus. Furthermore, a good agreement between the mathematical calculation and the experimental data validated the electromigration model proposed by I. A. Blech (Acta Mater., vol. 46, p. 3717, 1998). These new data will not only advance our own knowledge of metallic whiskering mechanism, but be helpful in developing mitigation strategies of metallic whiskers.
||Other, Other, Other