About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
Presentation Title |
SAC-In,Bi(Sb) Solder Joints with Multiphase Microstructures and Their Mechanical Properties Guided by CALPHAD Design |
Author(s) |
Xiaojing Wang, Shanshan Cai, Yuhang Wang |
On-Site Speaker (Planned) |
Xiaojing Wang, Yuhang Wang |
Abstract Scope |
A CALPHAD-guided solder alloy design and corresponding experiments were performed to study the relationship between microstructures and mechanical properties of SAC based solder alloys with different alloying elements Sb, Bi, In additions. Alloys with different matrix phases were selected for experiment, including Beta Sn, Beta SnIn, Gama InSn based and duplex alloys. It is found that the duplex alloys with indium addition show supreme strength while keeping the plasticity without degeneration. Also with the strain rate increasing, the strength of indium doped duplex alloy increase with the elongation almost no change under tensile test. In contrast, elongations of alloys such as Sn58Bi, Sn40BiCu and Sn3Ag05Cu alloys decrease with increasing strain rate. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Electronic Materials, Mechanical Properties |