About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
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Presentation Title |
Mechanism of Microstructure Evolution between Bi-Sn Layer Deposition and Substrate Elements |
Author(s) |
Ching Yu Yeh |
On-Site Speaker (Planned) |
Ching Yu Yeh |
Abstract Scope |
When using E-gun to deposit Bi/Sn film on Ni/Cu metallization layer, it can be found that the structure of Bi/Sn film formed is very special. When Sn is directly deposited on Cu, clusters are formed and react with Cu to form Cu-Sn IMCs with uneven thickness. However, when Sn is deposited on Cu with a Bi layer, a Cu-Sn IMC layer of uniform thickness is formed between the Bi/Cu layers. Under the same Sn depositing time, the thickness of Cu-Sn IMC formed by Sn depositing on Cu with Bi layer is larger than the thickness of IMC formed by Sn depositing directly on Cu, indicating that Bi layer may have a similar effect as a catalyst, helping Sn and Cu can form Cu-Sn IMC with uniform thickness. By understanding the film formation mechanism of Bi/Sn layer depositing on Cu, the low temperature die-attachment structure can be designed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Electronic Materials, Phase Transformations |