|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Dissolution Behavior in the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, SAC305, and Sn-58Bi Solders
||Andromeda Dwi Laksono, Yee-wen Yen
|On-Site Speaker (Planned)
||Andromeda Dwi Laksono
The interfacial reactions between Cu-2.0 wt% Be alloy (Alloy 25) and lead-free solders had been investigated in our previous study. However, there still is lacking information in the Alloy 25/lead-free solders systems. This study investigated the dissolution behavior and kinetic of Alloy 25 in molten Sn, Sn-3.0Ag-0.5Cu (SAC), and Sn-58Bi (SB) solders at 240, 270 and 300℃. The dissolution rate in each system was increased when the temperature was increased. The dissolution rate of Alloy 25 in molten solder were calculated and followed the order Sn > SAC305 > SB. The planar Cu3Sn and scalloped Cu6Sn5 phases were formed at the solder/Alloy 25 interface. The Ag3Sn phase was precipitated among Cu6Sn5 grain in the SAC/Alloy 25 system. The thickness of the Cu6Sn5 and Cu3Sn phases increases with the increase of the dissolution times and temperatures. The thickest IMC thickness and the highest dissolution were found in Sn/Alloy 25 system.