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Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
Presentation Title C-11: Effect of De-twinning on Tensile Strength of Nano-twinned Cu Films
Author(s) Chiahung Lee
On-Site Speaker (Planned) Chiahung Lee
Abstract Scope Tensile tests were carried on the electroplated Cu films with various densities of twin grain boundary. We found that the strength of the Cu films is highly related to the twin boundary density. The Cu film with a greater twin-boundary density has a larger fracture strength than the Cu film with a lesser twin-boundary density. Moreover, the de-twinning can be observed in the region where necking begins. Furthermore, with the analysis of the TEM images on the nano-twinned structure in the necking region of the fractured Cu films, the de-twinning mechanism attributes to two processes: (1) the ledge formation by the engagement of the dislocations with the twin boundaries and (2) the collapse of the ledges with the opposite twin-boundaries. In conclusion, the plastic deformation of nano-twinned Cu films is governed by the de-twinning of the nano-twinned structure.
Proceedings Inclusion? Planned:
Keywords Nanotechnology, Mechanical Properties, Copper / Nickel / Cobalt


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