|About this Abstract
||2023 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
||Interfacial Reactions in the Lead-free Solders/Cu-Fe Alloy(C194) Couples
||Yi Chin Liu, Yu-Yen Lee, Yee-Wen Yen
|On-Site Speaker (Planned)
||Yi Chin Liu
In this study, the solid/solid state interfacial reactions between the lead-free solders and Cu-2.35 wt.% Fe alloy (C194) were investigated. Three lead-free solders (LFS): Sn, Sn-3.0wt.%Ag-0.5wt.%Cu (SAC) and Sn-0.7wt.%Cu (SC) were first reacted with C194 at 245℃ for 15 s to form the LFS/C194 couple. Then the LSF/C194 couples were aged at 125,150 and 175℃ for 100 to 2000 h. The scanning electron microscope (SEM) and SEM with energy dispersive spectrometer (SEM/EDS) to examine surface morphology and intermetallic compound (IMC), respectively. The Cu6Sn5 phase was formed in all couples and its thickness was increased with the increase of aging times and temperatures. The Cu3Sn phase was formed at higher temperature and longer aging time. The Fe could inhibit the Cu3Sn phase growth. The total IMC growth mechanism is diffusion controlled in all LFS/C194 couples.