About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
|
Presentation Title |
Solid/Solid State Interfacial Reactions between Lead-free Solders
and Cu-Ti Alloy(C1990HP) |
Author(s) |
Hsiang Yu Chiu |
On-Site Speaker (Planned) |
Hsiang Yu Chiu |
Abstract Scope |
Interfacial reactions between lead-free solders (Sn, Sn-3.0Ag-0.5Cu (SAC) and Sn-0.7Cu (SC) alloys) and Cu-3.5wt% Ti alloy (C1990HP) by using the solid/solid reaction couple technique were investigated in this study. C1990HP first reacted with solders at 240°C with 15 s to form the solder/C1990 HP reaction couples. Couples were then aged at 125, 150 and 175°C for 100, 200, 500, 1000 and 2000 h. The surface morphology was examined by SEM. The IMC composition was analyzed by SEM/EDS and EPMA. Both the compositional data and related phase diagrams were used to determine the IMC. The results show that adding Ti could inhibit the Cu3Sn phase growth, and promote the Cu6Sn5 phase growth. The periodic layer structure was observed in the Sn/C1990HP couple aged at 175°C for 2000 h. This IMC growth type shows very different comparing with that in the SAC/C1990 HP and SC/C1990HP or solder/Cu systems. |
Proceedings Inclusion? |
Planned: |