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Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
Presentation Title Employment of Diamond-like Carbon and Chromium Carbide Coatings as Diffusion Barrier Layers against Ga-based Thermal Interface Materials (TIMs): Efficacy and Impact on Heat Transfer
Author(s) Yifan Wu, Amy Marconnet, Carol Handwerker
On-Site Speaker (Planned) Yifan Wu
Abstract Scope Room temperature liquid metal alloys from gallium have attracted attention as candidates for next-generation thermal interface materials (TIMs) for their high thermal conductivity and intrinsic conformability. However, high reactivity of Ga with metals, i.e. Al embrittlement and corrosion of Cu and Ni, presents a particular challenge that must be addressed for its successful integration into electronics. As a mitigation strategy against Ga corrosion, we tested diamond-like carbon (DLC) and chromium carbide (CrC) coatings for their efficacy as diffusion barriers. Both coating types were proven to offer excellent protection up to 30 days of accelerated aging in contact with Ga at 125℃, showing no interfacial reaction. The impact the barrier layers have on the heat transfer across the interface was measured as a function of both the coating type and the aging time. We demonstrate that a 5μm-thick CrC coating offers sufficient protection, but increases the thermal interface resistance by ~20%.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Surface Modification and Coatings, Phase Transformations

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3d-transition Metal-tin Compounds
3D Electromagnetic Simulation and Experimental Measurements of Performance of Antenna at mm-wave Frequencies: Surface Finish Effect
A Novel Synthesis Method of Cu NWs by Nucleation Control
Ab Initio Exploration of Alloying Elements for Stabilizing η’ Nanoprecipitates in Al-Zn-Mg Alloys
Ag and Cu Whisker Formation
Alternative Metal with Lower Resistivity than Cu: A First-principles Study
C-10: Bi-Sb-Se-Te Phase Equilibria Isothermal Tetrahedron at 400℃
C-11: Effect of De-twinning on Tensile Strength of Nano-twinned Cu Films
C-12: Laser-assisted Die Attach Process for SiC Power Semiconductor
C-9: 3D Electromagnetic Analysis and VNA Measurement of High-speed Signal Transmission in HLC-PCBs: Via Stub Effect
Competitive Degradation Mechanisms and Design Considerations for On-chip Resistor Structures
Composition Design of Coherent Precipitate-strengthening Multi-principal Element Alloys by High-throughput CALPHAD-type Calculation
Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step
Dissolution Behavior in the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, SAC305, and Sn-58Bi Solders
Effect of Cu Addition on Mechanical Properties of In-Sn Alloy Before and After Isothermal Aging
Effect of Trace Bi on the Mechanical Strength of Sn Solder Before and After Thermal Aging
Electric Current-induced Lattice Strain and Grain Orientation Change in Silver Strip
Electric Current Effects upon ƞ & ƞ’ Cu6Sn5 Intermetallic Compound
Electromigration-induced Abnormal IMC Volume Expansion in Micro Joints with Au/Pd(P)/Ni(P) Surface Finish
Employment of Diamond-like Carbon and Chromium Carbide Coatings as Diffusion Barrier Layers against Ga-based Thermal Interface Materials (TIMs): Efficacy and Impact on Heat Transfer
Flip-chip Encapsulation with Hybrid Organic Inorganic Passivation of Perovskite Solar Cells
Interfacial Reactions in the Lead-free Solders/Cu-Fe Alloy(C194) Couples
Machine Learning Models of Ultimate Tensile Strength and Elongation for Low-temperature Solder
Mechanism of Microstructure Evolution between Bi-Sn Layer Deposition and Substrate Elements
Microstructure and Interface Evolution of Bare Cu-Cu Bonding Using Cu-Ag Composite Paste during High Temperature Application
Multistep Electroplating for the Uniform Composition of Invar Electroplating
Research on the Mechanism of ENEPIG/Solder Joint Reliability
SAC-In,Bi(Sb) Solder Joints with Multiphase Microstructures and Their Mechanical Properties Guided by CALPHAD Design
Solder Joint Properties of Nickel-less Surface Finishes - Direct Electroless Gold (DEG) and Electroless Palladium Immersion Gold (EPIG)
Solid/Solid State Interfacial Reactions between Lead-free Solders and Cu-Ti Alloy(C1990HP)
Study of Interfacial Stability for Medium-temperature GeTe-based Thermoelectric Modules
Synchrotron White X-ray Nanodiffraction Study of Tin Whisker Growth Driven by Electric Current
Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage
Thermal Stability of Highly (111)-oriented Nanotwinned Ag Thin Film during Annealing Process
Two Phase Stability Affecting Electromigration Failure Mechanism of Solder Alloys
Use of Molecular Dynamics Simulations to Examine Crystal Growth from the Melt in Pure Sn Systems

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