ProgramMaster Logo
Conference Tools for 2023 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXII
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Chung University
Chih-Ming Chen, National Chung Hsing University
Jae-Ho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
Ming-Tzer Lin, National Chung Hsing University
Yee-wen Yen, National Taiwan University of Science and Technology
A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET)
Ligang Zhang, Central South University
Sehoon Yoo, KITECH
Vesa Vuorinen, Aalto University
Yu-chen Liu, National Cheng Kung University
Ting-Li Yang, National Yang Ming Chiao Tung University
Scope This is the 22nd in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/17/2022
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

3d-transition metal-tin compounds
3D Electromagnetic Analysis and VNA Measurement of High-speed Signal Transmission in HLC-PCBs: Via Stub Effect
3D Electromagnetic Simulation and Experimental Measurements of Performance of Antenna at mm-wave Frequencies: Surface Finish Effect
A novel synthesis method of Cu NWs by nucleation control
Ab initio exploration of alloying elements for stabilizing η’ nanoprecipitates in Al-Zn-Mg alloys
Ag and Cu Whisker formation
Alternative metal with lower resistivity than Cu: A first-principles study
Bi-Sb-Se-Te phase equilibria isothermal tetrahedron at 400℃
Blind hole and through hole filling with nano-twinned copper in bulid up pcbs
Competitive Degradation Mechanisms and Design Considerations for On-chip Resistor Structures
Composition design of coherent precipitate-strengthening multi-principal element alloys by high-throughput CALPHAD-type calculation
Development of low temperature sintering conductive thick film
Dissolution Behavior in the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, SAC305, and Sn-58Bi Solders
Effect of Cu addition on mechanical properties of In-Sn alloy before and after isothermal aging
Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films
Effect of trace Bi on the mechanical strength of Sn solder before and after thermal aging
Electric current-induced lattice strain and grain orientation change in silver strip
Electric current effects upon ƞ & ƞ’ Cu6Sn5 intermetallic compound
Electromigration-induced Abnormal IMC Volume Expansion in Micro Joints with Au/Pd(P)/Ni(P) Surface Finish
Employment of Diamond-like Carbon and Chromium Carbide Coatings as Diffusion Barrier Layers against Ga-based Thermal Interface Materials (TIMs): Efficacy and Impact on Heat Transfer
Flip-chip encapsulation with hybrid organic inorganic passivation of perovskite solar cells
Interfacial Reactions in the Lead-free Solders/Cu-Fe Alloy(C194) Couples
Laser-assisted die attach process for SiC power semiconductor
Machine learning models of ultimate tensile strength and elongation for low-temperature solder
Mechanism of microstructure evolution between Bi-Sn layer deposition and substrate elements
Microstructure and interface evolution of bare Cu-Cu bonding using Cu-Ag composite paste during high temperature application
Multistep electroplating for the uniform composition of invar electroplating
Osteo-angiogenic and antibacterial activity of a multifunctional micro-porous coating on zirconium alloy
Preferred orientation of Cu5Zn8 IMC grains on the Sn9Zn/(111) nt-Cu interface
Reduction of Kirkendall voids on Sn/(111)nt-Cu interface by substrate annealing induced impurity emission
Research on the mechanism of ENEPIG/solder joint reliability
SAC-In,Bi(Sb) solder joints with multiphase microstructures and their mechanical properties guided by CALPHAD design
Solder Joint Properties of Nickel-less Surface Finishes - Direct Electroless Gold (DEG) and Electroless Palladium Immersion Gold (EPIG)
Solid/Solid State Interfacial Reactions between Lead-free Solders and Cu-Ti Alloy(C1990HP)
Stabilization of aluminum dross by coating with PEG
Study of Interfacial Stability for Medium-temperature GeTe-based Thermoelectric Modules
Synchrotron White X-ray Nanodiffraction Study of Tin Whisker Growth Driven by Electric Current
Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage
Thermal stability of highly (111)-oriented nanotwinned Ag thin film during annealing process
Two Phase Stability Affecting Electromigration Failure Mechanism of Solder Alloys
Use of molecular dynamics simulations to examine crystal growth from the melt in pure Sn systems


Questions about ProgramMaster? Contact programming@programmaster.org