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About this Symposium
Meeting 2022 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Hiroshi Nishikawa, Osaka University
Shih-kang Lin, National Cheng Kung University
Chaohong Wang, National Chung Chung University
Chih Ming Chen, National Chung Hsing University
Jaeho Lee, Hongik University
Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology
A.S.Md Abdul Haseeb, University of Malaya
Vesa Vuorinen, Aalto University
Ligang Zhang, Central South University
Sehoon Yoo, KITECH
Yu-chen Liu, National Cheng Kung University
Ting-Li Yang, National Yang Ming Chiao Tung University
Scope This is the 21st in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/19/2021
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A Critical Analysis of Joining Processes for NiTi Shape Memory Alloys
Ab intio interfacial stability and Cu-segregation effect upon η’ and η2 precipitates in Al-Zn-Mg-Cu alloys
Bi orientation-dependence and mechanical properties in a Sn-Bi-Ag low-temperature lead-free solder
Comparison of NiCo and NiP Electroplating for Wear Resistant Probe Tip
Data-driven rational design of conductive copper-based alloys with high performance
Development of low temperature sintering conductive thick film
Effect of detwinning on tensile strength of nanotwinned Cu films
Effect of vertical interfaces on phase transformation behavior of MoS2
Effects of Cu surface structures on Cu-Cu bonding
Electric current-assisted treatment for 7075 aluminum alloy to withstand high-speed impact
Electronic material properties exploration using machine learning: in effective charge, hardness, and dissipation factor
Failure analysis and prediction of solder microbumps due to side wetting and electromigration by 3D X-ray
Filp-chip encapsulation with hybrid organic-inorganic passivation of perovskite solar cells
Interfacial reaction between In coated Cu sheet and ENIG substrate
Interfacial Reaction between Sn-rich solder and FeCoNiCu High-entropy Alloy
Interfacial Reactions between Sn-0.7 Cu Alloys C194, Alloy25, and C1990 Substrates
Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples
Mechanical performance of advanced multicomponent solder alloy under thermal aging
Mesoscale simulations guiding data-driven design of electronic materials
Morphological effect of patterned sapphire substrate on efficiency of white-light phosphor LED package
Novel Zr-Based Alloy with Low Young's Modulus and Magnetic Susceptibility for Biomedical Implants
Phase transformation temperatures of Sn-based solder alloys
Role of composition in the phase transition of Ge-Sb-Te alloys.
Self-healing Kirkendall Voids at the Joint Interface Between Sn and <111> Oriented and Nano-twinned Cu
Solution-processed Perovskite Photoabsorbers with Mixed Cations for Improved Stability in Solar Cells
Study of ferroelectricity and phase transitions in Hafnia
Study of Galvanized Sn Finished Ag Surface
The challenge of machine learning the stability of materials
The influence of morphology in ultrathin Ag structure on ZnO/Ag/ZnO transmittance grown by sputtering compared with simulation
Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)


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